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可制造性、可测试性、可装配性设计(DFM、DFT、DFA) |
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高密度、盲埋孔PCB设计(High Density, B/B PCB design) |
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PCB设计时散热的考虑(Thermal consideration in PCB design) |
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设计流程的优化(Design process optimize) |
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新颖的设计思路或方法技巧(New design methodology or technology) |
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PCB叠层方案的设计优化(PCB stack-up optimal design) |
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信号完整性仿真和分析方法(Signal Integrity simulation & analysis) |
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板级EMC设计(EMC in board design) |
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板级电源完整性分析(Power Integrity analysis) |
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SI分析在实际产品设计中的应用(SI application in practical product design) |
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产品的PCB设计方案(PCB design technique for a certain product) |
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PCB设计的电源处理技巧(Design skill dealing with Power signals) |
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团队协同合作的PCB设计(Team work in PCB design) |
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EDA软件的实用功能及应用(EDA software advanced function & application) |
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新型产品的设计、仿真软件(Introduct new layout & Simulation) |
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IC封装基板的设计方法(IC package design technique) |
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为成本考虑的PCB设计(Design for Cost-down consideration) |